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AS5263
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
V DD
V OUT
V KDOWN
VDD3
VDD5
I scr
DC supply voltage at pin VDD
Overvoltage
Output voltage OUT
Output voltage KDOWN
DC supply voltage at pin VDD3
DC supply voltage at pin VDD5
Input current (latchup immunity)
-18
-0.3
-0.3
-0.3
-0.3
-100
27
27
27
5
7
100
V
V
V
V
V
mA
No operation
permanent
Norm: JEDEC 78
Electrostatic Discharge
ESD
Electrostatic discharge
±4
kV
Norm: MIL 883 E method 3015
This value is applicable to pins VDD, GND, OUT,
and KDOWN.
All other pins ±2 kV.
Temperature Ranges and Storage Conditions
T strg
T Body
H
MSL
Storage temperature
Body temperature (Lead-free package)
Humidity non-condensing
Moisture Sensitive Level
-55
5
3
+150
260
85
oC
oC
%
Min -67oF; Max +257oF
t=20 to 40s,
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020 “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices” .
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Represents a maximum floor life time of 168h
www.austriamicrosystems.com/AS5263
Revision 1.4
5 - 37
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